-Ethylmethylimidazole
Chinese name: -Ethylmethylimidazole-Ethylmethylimidazole
English name:
English alias:
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Molecular formula :
Molecular weight:
Purity:
Usage: Used for epoxy resin bonding, coating, pouring, encapsulation, impregnation and composite materials, etc.
Used for epoxy resin curing Agent, can be widely used in epoxy resin bonding, coating, pouring, encapsulation, impregnation and composite materials, etc.
-Ethylmethylimidazole has extremely good compatibility with epoxy resin, reference dosage -. Epoxy compound trial period -. Curing reference conditions are degrees + degrees or degrees + degrees. Cured material deformation temperature - degrees. -The thermal oxidation resistance, chemical resistance, and especially acid resistance of cured epoxy resin are superior to m-phenylenediamine curing agent. - As the amount of curing agent increases and the curing temperature increases, the deformation resistance temperature increases.
Properties: light yellow thick liquid.
Density. ()(.)
Melting point-(.)
Boiling point
Flash point 3
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Viscosity:
Activity test: qualified
- Ethylmethylimidazole packaging price. Yuan
2-Ethyl-4-methylimidazole 931-36-2